Multilayer high vertical aspect ratio thin film structures
AssigneeThe Regents of the University of California
InventorChristopher G. Keller
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Abstract
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures. Various material properties may be varied within the structures to produce electrical, mechanical or electromechanical devices.
Claims39
A method of fabrication of a micromechanical element, comprising:
- providing a mold having a depth;
- coating said mold with a sacrificial thin film layer;
- filling a first portion of said mold with a material having properties;
- filling a second portion of said mold with a material having properties at least one of which is different from the material filling said first portion of said mold;
- and
- etching said sacrificial thin film layer.
A thin film structure, comprising:
- a network of members shaped as ribs or tubes having a thickness and wherein an extent of said thin film structure in any direction is greater than about twice said thickness, a first portion of said structure being composed of a material having properties, and a second portion of said structure being composed of material having properties at least one of which is different from the material composing said first portion of said structure.
A thin film structure, comprising:
- a network of members shaped as ribs or tubes having a thickness and
- a bimorph for lifting said network out of a mold and
- wherein an extent of said thin film structure in any direction is greater than about twice said thickness.
Dependencies are inferred from the claim text.