Method of severing a thin film semiconductor device
AssigneeUnited Solar Systems Corporation
InventorsPrem Nath, Craig N. Vogeli
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Abstract
A method of severing a thin film semiconductor device. The semiconductor device includes a substrate having a first electrode region formed thereon, a semiconductor body formed of layers of thin film semiconductor alloy material disposed upon the base electrode, a transparent, electrically conductive second electrode deposited atop the semiconductor body, and a containment layer of polymeric material associated with the first or second electrode in at least one region to permit subsequent severing of the device into a plurality of devices through said containment layer region.
Claims4
A method of severing a semiconductor device into at least two smaller devices, said semiconductor device including a thin film semiconductor body sandwiched between a base electrode formed on a substrate and a transparent, electrically conductive top electrode formed of an at least partially light transmissive conductive material, said method including the steps of:
- depositing a containment layer formed of polymeric material atop said top electrode on at least one region through which said device is to be severed to prevent formation of shards in the top electrode when the device is severed;
- severing the device from the top electrode side thereof by first severing through the containment layer such that the containment layer cushions and contains the top electrode, thereby preventing the formation of top electrode shards and subsequent short circuiting of the device.
Dependencies are inferred from the claim text.