Edge feed ink delivery thermal inkjet printhead structure and method of fabrication

A print cartridge for an ink-jet printer comprising:

• an ink reservoir for containing a plurality of ink supplies, each of said supplies containing an ink of a different color;
• a nozzle member having a plurality of ink orifices formed therein;
• a substrate, coupled to said nozzle member, having a first outer edge and a second outer edge;
• a plurality of heating means formed on said substrate, each of said heating means being located proximately to an associated one of said orifices for vaporizing a portion of ink and expelling said ink from said associated one of said orifices for vaporizing a portion of ink and expelling said ink from said associated orifice;
• and
• a barrier layer between said substrate and said nozzle member, having a fluid channel leading to each of said orifices from said ink reservoir, said fluid channel allowing ink from said ink reservoir to flow around said first outer edge and said second outer edge of said substrate proximate to said orifices, said fluid channel further comprising a plurality of ink channels and a plurality of vaporization chambers, each of said ink channels being fiuidically coupled between said ink reservoir and said vaporization chambers such that a differing color ink from said supplies flows through a separate channel, each of said vaporization chambers being associated with a predetermined specific ink orifice and its related heating means.

A method for manufacturing a thermal ink-jet printhead structure, comprising:

• a. providing a substrate comprised of silicon;
• b. forming a layer of silicon dioxide on said substrate;
• c. forming a layer of silicon nitride on said layer of silicon dioxide;
• d. removing a portion of said layer of silicon nitride so as to leave a section of silicon nitride remaining intact on said layer of silicon dioxide, said section of silicon nitride being surrounded by a plurality of exposed regions of said layer of silicon dioxide;
• e. removing said exposed regions of said layer of silicon dioxide;
• f. oxidizing said substrate beneath said exposed regions of said layer of silicon dioxide in order to form a field oxide layer surrounding said section of silicon nitride;
• g. forming a layer of polycrystalline silicon on said section of silicon nitride, said layer of polycrystalline silicon, said section of silicon nitride, and said layer of silicon dioxide thereunder together forming a gate of a transistor;
• h. forming a transistor source region and a transistor drain region within said substrate adjacent said gate;
• i. applying a layer of dielectric material onto said field oxide layer, said gate, said source region, and said drain region;
• j. forming a plurality of openings through said layer of dielectric material in order to provide access to said gate, said source region, and said drain region;
• k. applying a layer of electrically resistive material onto said layer of dielectric material, said layer of electrically resistive material being in direct electrical contact with said gate, said source region, and said drain region through said openings;
• l. applying a layer of conductive material onto said layer of electrically resistive material in order to form a multi-layer structure, said layer of electrically resistive material in said multi-layer structure having at least one uncovered section wherein said layer of conductive material is absent therefrom, said uncovered section functioning as a heating resistor, said layer of electrically resistive material being covered with said layer of conductive material at said source region, said drain region, and said gate of said transistor;
• m. applying a portion of protective material onto said resistor, including the steps of:
• i. applying a passivation and anti-cavitation layer onto said resistor;
• ii. applying an ink barrier layer onto said anti-cavitation layer;
• and
• n. securing a plate member having at least one opening therethrough onto said portion of protective material, said portion of protective material having a section thereof removed directly beneath said opening through said plate member in order to form an ink receiving cavity thereunder, said heating resistor being positioned beneath and in alignment with said ink receiving cavity in order to impart heat thereto;
• said ink barrier layer including a fluid channel, communicating with an ink reservoir, leading from said reservoir to said opening and said heating resistor, said fluid channel allowing ink to flow from said ink reservoir around at least one outer edge of said substrate into said ink receiving cavity.