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AssigneeInternational Business Machines Corporation
InventorsTai A. Cao, Herbert I. Stoller, Thanh D. Trinh, Lloyd A. Walls
Estimating the term…
Thin-film conductor technology is utilized to form resistors of precisely controlled value within the interior of multi-chip modules to properly terminate network circuits which interconnect one or more chips with either output pin connections or other chips on the multi-chip module. By forming and disposing the resistors within the interior of the multi-chip module, the terminating resistors may be manufactured during the multi-chip module manufacturing process. This approach preserves valuable surface area available for interconnecting the computer chips to the multi-chip module rather than consuming scarce surface area with termination resistors and other circuit elements necessary to adapt the multi-chip module and the other computer chips to each other.
A circuit interconnecting terminals on at least two electronic chips comprising:
A circuit incorporated into and on a ceramic module for connecting a driver to a terminal comprising:
An interconnection circuit connecting a driving terminal on a first electronic chip supported on a ceramic module to a driven terminal on a second electronic chip supported on said ceramic module comprising:
A circuit for connecting a driver on a first chip to at least two receivers on a second chip, both said chips supported by and electrically connected through said circuit incorporated into a ceramic module having a plurality of ceramic layers fused into a unitary structure comprising;
An interconnection circuit connecting a receiver terminal on an electronic chip to a pin connection on a ceramic module comprising:
Dependencies are inferred from the claim text.