Film IC with connection terminals

A film integrated circuit, comprising:

• at least one row of connection terminals to be connected in metallized holes of a given diameter formed in a printed circuit board;
• each of said connection terminals having a widened portion, a pocket-like clamping contour to be connected to pads of a film IC being mounted on one side of said widened portion, and a strip-like, comparatively narrower connection piece to be connected to the printed circuit board being mounted to another side of said widened portion;
• at least one of said connection pieces having a V-bend in a bending region forming a spring with one free arm and another arm being connected to said widened portion, for plug contacting in the holes formed in the printed circuit board, said V-bend having a bending radius being markedly smaller than the given diameter of a corresponding one of the holes formed in the printed circuit board;
• and
• said bent connection pieces having a material thickness in said bending region being reduced by approximately 50%.