US 5,635,744 AGranted

Semiconductor memory and semiconductor device having SOI structure

AssigneeMitsubushi Denki Kabushiki Kaisha

InventorsHideto Hidaka, Takahiro Tsuruda, Katsuhiro Suma

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Abstract

A semiconductor memory and device comprising a plurality of N-channel and P-channel transistor regions, a first and a second field shield region, and an oxide isolation region. The first field shield region is disposed so as to isolate the N-channel transistor regions from one another, and the second field shield region is provided to isolate the P-channel transistor regions from one another. The oxide isolation region is furnished to isolate the N-channel transistor regions from the P-channel transistor regions. The isolation effected by the field shield regions and the isolation provided by the oxide isolation region combine to suppress latch-up, fix the potential in the body regions of the MOS transistors making up the memory or device, and minimize the layout area of the memory or device.

Claims22

Dependent claims

A semiconductor device formed on an SOI substrate having an SOI active layer over an oxide film, said semiconductor device comprising:

a plurality of N-channel transistor regions each having an N-channel transistor formed therein;
and
a plurality of P-channel transistor regions each having a P-channel transistor formed therein;
wherein said N-channel transistor regions and said P-channel transistor regions each comprise:
a pair of a source and a drain region formed a predetermined distance apart in said SOI active layer;
and
a body region formed between said source and said drain region in said SOI active layer;
said semiconductor device further comprising:
a first field shield region composed of a first impurity region formed in said SOI active layer and of a first field shield gate electrode formed over said first impurity region, said first field shield region isolating said N-channel transistor regions from one another;
a second field shield region composed of a second impurity region formed in said SOI active layer and of a second field shield gate electrode formed over said second impurity region, said second field shield region isolating said P-channel transistor regions from one another;
and
a third impurity region formed in said SOI active layer between said first and said second impurity region, said third impurity region being supplied with a predetermined potential;
wherein the potential supplied to said third impurity region is given, via at least one of said first and said second impurity region, to the body regions of the transistor regions of at least one of the two conductivity types, one conductivity type being that of said N-channel transistor regions, the other conductivity type being that of said P-channel transistor regions.

10 more elements

A semiconductor device formed on an SOI substrate having an SOI active layer over an oxide film, said semiconductor device comprising:

a plurality of N-channel transistor regions each having an N-channel transistor formed therein;
and
a plurality of P-channel transistor regions each having a P-channel transistor formed therein;
wherein said N-channel transistor regions and said P-channel transistor regions each comprise:
a pair of a source and a drain region formed a predetermined distance apart in said SOI active layer;
and
a body region formed between said source and said drain region in said SOI active layer;
said semiconductor device further comprising:
a first field shield region composed of a first impurity region formed in said SOI active layer and of a first field shield gate electrode formed over said first impurity region, said first field shield region isolating said N-channel transistor regions from one another;
a second field shield region composed of a second impurity region formed in said SOI active layer and of a second field shield gate electrode formed over said second impurity region, said second field shield region isolating said P-channel transistor regions from one another;
a third and a fourth impurity region formed a predetermined distance apart in said SOI active layer between said first and said second impurity region, one of said third and said fourth impurity region being in contact with said first impurity region, the other of said third and said fourth impurity region being in contact with said second impurity region, said third and said fourth impurity region having a different conductivity type each;
and
a third field shield region composed of a fifth impurity region formed in said SOI active layer between said third and said fourth impurity region and of a third field shield gate electrode formed over said fifth impurity region, said third field shield region isolating said third impurity region from said fourth impurity region.

10 more elements

A semiconductor device formed on an SOI substrate having an SOI active layer over an oxide film, said semiconductor device comprising:

a plurality of N-channel transistor regions each having an N-channel transistor formed therein;
and
a plurality of P-channel transistor regions each having a P-channel transistor formed therein;
wherein said N-channel transistor regions and said P-channel transistor regions each comprise:
a pair of a source and a drain region formed a predetermined distance apart in said SOI active layer;
and
a body region formed between said source and said drain region in said SOI active layer;
said semiconductor device further comprising:
a first field shield region composed of a first impurity region formed in said SOI active layer and of a first field shield gate electrode formed over said first impurity region, said first field shield region isolating said N-channel transistor regions from one another;
a second field shield region composed of a second impurity region formed in said SOI active layer and of a second field shield gate electrode formed over said second impurity region, said second field shield region isolating said P-channel transistor regions from one another;
a third impurity region formed in said SOI active layer between said first and said second impurity region, said third impurity region being supplied with a first potential;
and
a fourth impurity region different in conductivity type from said third impurity region and formed in said SOI active region so that one of said first and said second field shield region is disposed between said third and said fourth impurity region, said fourth impurity region being supplied with a second potential;
wherein said second potential supplied to said fourth impurity region is given, via the impurity region of one of said first and said second field shield region disposed between said third and said fourth impurity region, to the body regions of those transistor regions of one conductivity type which are isolated from one another by that one field shield region;
and
wherein said first potential supplied to said third impurity region is given, via the impurity region of the other one of said first and said second field shield region, to the body regions of the transistor regions of the other conductivity type.

13 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/463,795Filed 5 Jun 1995
Priority: JP 6-2148058 Sep 1994
Granted: 3 Jun 1997
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

H10D 84/854
Complementary IGFETs, e.g. CMOS: comprising arrangements for preventing bipolar actions between the different IGFET regions, e.g. arrangements for…
H10D 84/85
Of only insulated-gate FETs [IGFET]: complementary IGFETs, e.g. CMOS
H10D 86/201
Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless…
H10P 90/1906
Preparing vertically inhomogeneous wafers: preparing SOI wafers