Insulated gate type semiconductor device in which the reliability and characteristics thereof are not deteriorated due to pressing action and power inverter using the same

An insulated gate type semiconductor device comprising:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a plurality of second semiconductor regions of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface and including a channel portion;
• a plurality of third semiconductor regions of said first conductivity type, provided in each one of said second semiconductor regions and exposed at said first main surface;
• a gate electrode having an active portion located above said first main surface and sufficiently close thereto to control flow of current between said first and third semiconductor regions via said channel portion;
• a first gate insulating layer on said first main surface and lying between said active portion of said gate electrode and said channel portion;
• a first main electrode on said first main surface of said substrate contacting said third semiconductor regions and having at least one raised contact portion providing an external contact surface for contact with an external electrode;
• a supporting insulating layer on said first main surface lying between said raised contact portion of said first main electrode and said first main surface of said substrate and having a thickness greater than 1 .mu.m, said supporting insulating layer being provided directly on a part of said first main surface between said second semiconductor regions;
• and
• a second main electrode on said second main surface,
• wherein a surface of said first main electrode above said active portion of said gate electrode is closer to said first main surface than said external contact surface of said first main electrode.

An insulated gate type semiconductor device comprising:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a plurality of second semiconductor regions of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface and including a channel portion;
• a plurality of third semiconductor regions of said first conductivity type, provided in each one of said second semiconductor regions and exposed at said first main surface;
• a gate electrode having an active portion located above said first main surface and sufficiently close thereto to control flow of current between said first and third semiconductor regions via said channel portion;
• a first gate insulating layer on said first main surface and lying between said active portion of said gate electrode and said channel portion;
• a first main electrode on said first main surface of said substrate contacting said third semiconductor regions to provide an interface therewith and having at least one raised contact portion providing an external contact surface for contact with an external electrode;
• a supporting insulating layer formed on said first main surface to provide an interface therewith and lying between said raised contact portion of said first main electrode and said first main surface of said substrate, said supporting insulating layer being provided directly on a part of said first main surface between said second semiconductor regions;
• and
• a second main electrode on said second main surface,
• wherein a surface of said first main electrode above said active portion of said gate electrode is closer to said first main surface than said external contact surface of said first main electrode, and wherein said interface of said first main electrode with said third semiconductor regions, respectively, is coplanar with said interface of said supporting insulating layer with said first main surface.

In an insulated gate type semiconductor device comprising a semiconductor substrate having a first region of a first conductivity type;

• a plurality of second semiconductor regions of a second, opposite conductivity type, provided in said first region and each of which is exposed at a main surface of said substrate and includes a channel portion;
• a plurality of third semiconductor regions of said first conductivity type, provided in each of said second semiconductor regions and exposed at said main surface;
• a gate electrode which controls current flow between said second and said third semiconductor regions via said channel portion;
• and a main electrode which has a first portion contacting said third semiconductor regions, a second portion extending above said gate electrode and a third portion providing a raised external contact surface, said gate electrode being insulated above and below by insulating films, the improvement comprising a supporting insulating layer on a main surface of said substrate, said supporting insulating layer underlying said third portion of said main electrode, having a thickness substantially greater than the thickness of said insulating film below said gate electrode and being provided directly on a part of said main surface between said second semiconductor regions, whereby said raised external contact surface is more remote from said main surface of said substrate than said second portion of said main electrode.

An assembly comprising an insulated gate type semiconductor device comprising:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a second semiconductor region of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface and including a channel portion;
• a third semiconductor region of said first conductivity type, provided in said second semiconductor region and exposed at said first main surface;
• a gate electrode having an active portion located above said first main surface and sufficiently close thereto to control flow of current between said first and third semiconductor regions via said channel portion;
• a first gate insulating layer on said first main surface and lying between said active portion of said gate electrode and said channel portion;
• a second gate insulating layer lying above said active portion of said gate electrode;
• a first main electrode on said first main surface of said substrate contacting said third semiconductor region and having at least one raised contact portion providing an external contact surface for contact with an external electrode, said external contact surface not overlapping said active portion of said gate electrode;
• a supporting insulating layer on said first main surface lying between said raised contact portion of said first main electrode and said first main surface and having a thickness greater than the thickness of said first gate insulating layer, said supporting insulating layer being provided directly on a surface of said first semiconductor region;
• and
• a second main electrode on said second main surface;
• said assembly further including an electrode body held in pressing contact with said external contact surface of said first main electrode of said semiconductor device.

An assembly comprising an insulated gate type semiconductor device comprising:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a second semiconductor region of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface and including a channel portion;
• a third semiconductor region of said first conductivity type, provided in said second semiconductor region and exposed at said first main surface;
• a gate electrode having an active portion located above said first main surface and sufficiently close thereto to control flow of current between said first and third semiconductor regions via said channel portion;
• a first gate insulating layer on said first main surface and lying between said active portion of said gate electrode and said channel portion;
• a first main electrode on said first main surface of said substrate contacting said third semiconductor region and having at least one raised contact portion providing an external contact surface for contact with an external electrode;
• a supporting insulating layer on said first main surface lying between said raised contact portion of said first main electrode and said first main surface of said substrate and having a thickness greater than 1 .mu.m, said supporting insulating layer being provided directly on a surface of said first semiconductor region;
• and
• a second main electrode on said second main surface;
• wherein a surface of said first main electrode above said active portion of said gate electrode is closer to said first main surface than said external contact surface of said first main electrode;
• said assembly further including an electrode body held in pressing contact with said external contact surface of said first main electrode of said semiconductor device.

An insulated gate type semiconductor device comprising:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a plurality of second semiconductor regions of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface;
• a plurality of third semiconductor regions of said first conductivity type, respectively provided in said second semiconductor regions and exposed at said first main surface;
• a plurality of gate electrode active portions located respectively above said first main surface adjacent said second semiconductor regions to control flow of current between said first semiconductor region and said third semiconductor regions;
• a plurality of first gate insulating layers respectively lying between said gate electrode active portions and said second semiconductor regions;
• a first main electrode structure connecting said plurality of third semiconductor regions to each other and adapted to contact an external electrode;
• a second main electrode on said second main surface of said substrate;
• a groove formed in said first main surface of said substrate;
• a groove insulating layer covering at least part of the surface of said groove;
• a conductive polycrystalline silicon layer lying above said groove insulating layer and connected to said plurality of gate electrode active portions;
• and
• a conductive metal layer in said groove contacting said polycrystalline silicon layer.

A power inverter comprised of a plurality of circuits each of which is formed by serially connecting at least a pair of switching devices between DC terminals, wherein said plurality of circuits which are an integer times as large as the number of phases on an AC side of the power inverter are connected in parallel, wherein AC terminals are led out from midpoint connections of the switching devices which are serially connected to form individual ones of said circuits, and wherein each of said switching devices comprises:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a second semiconductor region of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface and including a channel portion;
• a third semiconductor region of said first conductivity type, provided in said second semiconductor region and exposed at said first main surface;
• a gate electrode having an active portion located above said first main surface and sufficiently close thereto to control flow of current between said first and third semiconductor regions via said channel portion;
• a first gate insulating layer on said first main surface and lying between said active portion of said gate electrode and said channel portion;
• a second gate insulating layer lying above said active portion of said gate electrode;
• a first main electrode on said first main surface of said substrate contacting said third semiconductor region and having at least one raised contact portion providing an external contact surface for contact with an external electrode, said external contact surface not overlapping said active portion of said gate electrode;
• a supporting insulating layer on said first main surface lying between said raised contact portion of said first main electrode and said first main surface and having a thickness greater than the thickness of said first gate insulating layer, said supporting insulating layer being provided directly on a surface of said first semiconductor region;
• and
• a second main electrode on said second main surface.

A power inverter comprised of a plurality of circuits each of which is formed by serially connecting at least a pair of switching devices between DC terminals, wherein said plurality of circuits which are an integer times as large as the number of phases on an AC side of the power inverter are connected in parallel, wherein AC terminals are led out from midpoint connections of the switching devices which are serially connected to form individual ones of said circuits, and wherein each of said switching devices comprises:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a second semiconductor region of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface and including a channel portion;
• a third semiconductor region of said first conductivity type, provided in said second semiconductor region and exposed at said first main surface;
• a gate electrode having an active portion located above said first main surface and sufficiently close thereto to control flow of current between said first and third semiconductor regions via said channel portion;
• a first gate insulating layer on said first main surface and lying between said active portion of said gate electrode and said channel portion;
• a first main electrode on said first main surface of said substrate contacting said third semiconductor region and having at least one raised contact portion providing an external contact surface for contact with an external electrode;
• a supporting insulating layer on said first main surface lying between said raised contact portion of said first main electrode and said first main surface of said substrate and having a thickness greater than 1 .mu.m, said supporting insulating layer being provided directly on a surface of said first semiconductor region;
• and
• a second main electrode on said second main surface,
• wherein a surface of said first main electrode above said active portion of said gate electrode is closer to said first main surface than said external contact surface of said first main electrode.

A power inverter comprised of a plurality of circuits each of which is formed by serially connecting at least a pair of switching devices between DC terminals, wherein said plurality of circuits which are an integer times as large as the number of phases on an AC side of the power inverter are connected in parallel, wherein AC terminals are led out from midpoint connections of the switching devices which are serially connected to form said circuits, and wherein each of said switching devices comprises:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a second semiconductor region of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface and including a channel portion;
• a third semiconductor region of said first conductivity type, provided in said second semiconductor region and exposed at said first main surface;
• a gate electrode having an active portion located above said first main surface and sufficiently close thereto to control flow of current between said first and third semiconductor regions via said channel portion;
• a first gate insulating layer on said first main surface and lying between said active portion of said gate electrode and said channel portion;
• a first main electrode on said first main surface of said substrate contacting said third semiconductor region to provide an interface therewith and having at least one raised contact portion providing an external contact surface for contact with an external electrode;
• a supporting insulating layer on said first main surface lying between said raised contact portion of said first main electrode and said first main surface of said substrate and having a thickness greater than 1 .mu.m, said supporting insulating layer being provided directly on a surface of said first semiconductor region;
• and
• a second main electrode on said second main surface,
• wherein a surface of said first main electrode above said gate electrode is closer to said first main surface than said external contact surface of said first main electrode, and wherein said interface of said first main electrode with said third semiconductor region is coplanar with said interface of said supporting insulating layer with said first main surface.

A power inverter comprised of a plurality of circuits each of which is formed by serially connecting at least a pair of switching devices between DC terminals, wherein said plurality of circuits which are an integer times as large as the number of phases on an AC side of the power inverter are connected in parallel, wherein AC terminals are led out from midpoint connections of the switching devices which are serially connected to form individual ones of said circuits, and wherein each of said switching devices comprises:

• a semiconductor substrate having a first main surface and a second main surface;
• a first semiconductor region of a first conductivity type, provided in said substrate and exposed at said first main surface;
• a plurality of second semiconductor regions of a second conductivity type, opposite to said first conductivity type, provided in said first semiconductor region and exposed at said first main surface;
• a plurality of third semiconductor regions of said first conductivity type, respectively provided in said second semiconductor regions and exposed at said first main surface;
• a plurality of gate electrode active portions located respectively above said first main surface adjacent said second semiconductor regions to control flow of current between said first semiconductor region and said third semiconductor regions;
• a plurality of first gate insulating layers respectively lying between said gate electrode active portions and said second semiconductor regions;
• a first main electrode structure connecting said plurality of third semiconductor regions to each other and adapted to contact an external electrode;
• a second main electrode on said second main surface of said substrate;
• a groove formed in said first main surface of said substrate;
• a groove insulating layer covering at least part of the surface of said groove;
• a conductive polycrystalline silicon layer lying above said groove insulating layer and connected to said plurality of gate electrode active portions;
• and
• a conductive metal layer in said groove contacting said polycrystalline silicon layer.