Multilayer electronic component
AssigneeMurata Manufacturing Co., Ltd.
InventorsKenji Kubota, Norio Sakai, Shoichi Kawabata
Life of this patent
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Abstract
A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.
Claims13
A multilayer electronic component for mounting on a surface of a substrate with external electrodes of said multilayer electronic component being soldered to the substrate, the multilayer electronic component comprising:
- a laminated ceramic sintered body having a plurality of stacked insulating sheets with internal circuit elements interposed therebetween,
- said ceramic sintered body having first and second opposite major surfaces and side surfaces connecting said major surfaces with each other;
- said side surfaces having a boundary surface that extends parallel to said major surfaces so as to define a first portion of said ceramic sintered body that includes said first major surface, and a second portion of said ceramic sintered body that includes said second major surface;
- a plurality of external electrodes provided on outer surfaces of said ceramic sintered body, at least one of said external electrodes comprising an exposed conductor located in a recess, said recess being a portion of a via hole formed in said ceramic sintered body, said exposed conductor being electrically connected with said internal circuit elements, said external electrodes being exposed only on said first portion of said ceramic sintered body.
A multilayer electronic component for mounting on a surface of a substrate with external electrodes of said multilayer electronic component being soldered to the substrate, the multilayer electronic component comprising:
- a laminated ceramic sintered body having a plurality of stacked insulating sheets with internal circuit elements interposed therebetween,
- said ceramic sintered body having first and second opposite major surfaces and side surfaces connecting said major surfaces with each other;
- steps disposed on said side surfaces extending parallel to said major surfaces so as to define a first portion of said ceramic sintered body that includes said first major surface, and a second portion of said ceramic sintered body that includes said second major surface, side surfaces of said first portion being recessed relative to side surfaces of said second portion;
- a plurality of external electrodes provided on outer surfaces of said ceramic sintered body, at least one of said external electrodes comprising an exposed conductor located in a recess, said recess being a portion of a via hole formed in said ceramic sintered body, said exposed conductor being electrically connected with said internal circuit elements, said external electrodes being exposed only on said first portion of said ceramic sintered body.
Dependencies are inferred from the claim text.