Resin composition for sealing film-made liquid crystal cells

Abstract

A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers. The said epoxy resin contains a polysulfide modified epoxy resin expressed by the general formula (1) in an amount of 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000. Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sup.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50. A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.

Dependencies are inferred from the claim text.