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US 5,635,240 AGranted
Electronic coating materials using mixed polymers
AssigneeDow Corning Corporation
InventorsLoren A. Haluska, Keith W. Michael
Life of this patent
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Abstract
The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a polysilazane on a substrate and heating the coated substrate at a temperature sufficient to convert the resins to ceramics.
Claims7
A method of forming a coating on an electronic substrate comprising:
- applying a coating composition comprising between about 10 and about 90 wt. % hydrogen silsesquioxane resin and between about 90 and about 10 wt. % polysilazane onto an electronic substrate;
- and
- heating the coated substrate at a temperature sufficient to convert the coating composition into a ceramic coating.
Dependencies are inferred from the claim text.