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US 5,635,221 AGranted
Injection molding apparatus for resin using gas injection
AssigneeLG Electronics Inc.
InventorJin H. Han
Life of this patent
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Abstract
An injection molding apparatus for a resin structure uses gas injection. The apparatus includes a resin supply that feeds more than one resin to a mold, a gas exhaust that discharges gas supplied to the resin in order to closely contact the resin to the mold, and a supply selector that selectively opens and closes the resin supply using the pressure of the discharged gas to supply a different kind of resin onto the inner surface of a previously supplied resin.
Claims4
An injection molding apparatus for a resin structure using gas injection comprising:
- resin supplying means for feeding more than one resin to a mold;
- gas exhausting means for discharging gas supplied to resin in order to closely contact said resin to said mold;
- and
- selective supply means for selectively opening/closing said resin supplying means by the pressure of the discharged gas to supply a different kind of resin onto the inner surface of a previously located resin.
1 more element
Dependencies are inferred from the claim text.