Method for producing semiconductor device

A method for producing a semiconductor device comprising the steps of:

• disposing a functional element in each cavity of a multi-cavity circuit board, the multi-cavity circuit board having a number of cavities opening upward;
• sprinkling fine resin powders over the entire surface of the multi-cavity board and removing resin powders not located in the cavities;
• filling each of the cavities with resin fine powders containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating;
• heating the resin fine powders filling each of the cavities so as to melt the resin fine powders;
• and
• curing the molten resin filling each of the cavities.

A method for producing a semiconductor device comprising the steps of:

• disposing a plurality of functional elements on a surface of a flat circuit board;
• overlaying a sealing resin sheet with a predetermined thickness containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating, and having concave portions which cover the respective functional elements on the flat circuit board, on the flat circuit board;
• and
• molding the sealing resin sheet on the flat circuit board into a desired shape and sealing the respective functional elements in the desired shape.

A method for producing a semiconductor device comprising the steps of:

• disposing a plurality of light-emitting diodes on a surface of a flat circuit board;
• overlaying a reflective plate with a reflective function, having openings capable of accommodating each of the light-emitting diodes, on the flat circuit board so that each of the light-emitting diodes is accommodated in each of the openings;
• overlaying a sealing resin sheet with a predetermined thickness containing, as a sealing resin, one of a thermoplastic resin and a thermosetting resin which is melted by heating and is cured by further heating, on the reflective plate;
• heating and pressurizing the sealing resin sheet on the reflective plate so that the sealing resin sheet is melted to be filled in each of the openings of the reflective plate;
• covering an entire surface of the reflective plate with the molten resin;
• and
• curing the molten resin.