Collimated deposition apparatus and method

A method of depositing a coating on a workpiece, comprising the steps of:

• supporting the workpiece in a stationary position in a chamber;
• emitting particles from a magnetron sputter source substantially uniformly throughout an area of greater lateral extent than the workpiece, including an area within the central region of said sputter source generally opposing said workpiece so that at least some of said particles will be deposited on said workpiece, the individual deposited particles impinging on the surface of the workpiece at angles of incidence;
• passing the particles through a collimating filter having a plurality of substantially identical transmissive cells with a length to diameter ratio defining an aspect ratio in the range of 1:1 to 3:1 positioned between the source and the workpiece to limit the angles of incidence at which the particles can impinge upon the workpiece;
• and
• maintaining pressure within the chamber at a level which is sufficiently low to prevent substantial scattering of the particles between the collimating filter and the workpiece.

Sputtering apparatus for depositing a step coating in an opening in a workpiece, said opening having an aspect ratio comprising:

• a chamber;
• means for supporting the workpiece in the chamber;
• a sputter source for emitting particles for forming the coating on the workpiece, so that at least some of said particles will be deposited on said workpiece, the individual deposited particles impinging on the surface of the workpiece at angles of incidence;
• a particle collimating filter having a plurality of transmissive cells positioned between the source and the workpiece for limiting the angles of incidence at which the particles can impinge upon the workpiece;
• and
• means for adjusting the filter so that the cells have a length to diameter ratio which may be varied.

A sputtering apparatus for depositing a thin film onto an opening in a substrate, said opening having a bottom wall and a side wall, comprising:

• a vacuum chamber;
• means for supporting said substrate in a stationary position within said vacuum chamber;
• a magnetron sputter source having a surface generally opposing said substrate for emitting particles uniformly from an area of said surface which includes the center thereof and which is larger than the substrate;
• a stationary particle collimating filter positioned between the sputter source and the substrate, said collimating filter comprising a plurality of substantially identical individual cells through which particles emitted from said sputter source must pass before reaching said substrate, said filter being spaced apart from said substrate by a distance which is sufficient to avoid shadowing of deposited film by said collimating filter, said cells having an aspect ratio defined by the length and width thereof, the aspect ratio of the cells being selected such that a substantial thickness of film is deposited on a sidewall of said opening.