Dry adhesive joining of layers of electronic devices

In a method for fabrication of a high-density electronic package wherein a plurality of electronic device layers, which in raw form comprise a plurality of electronic devices arrayed on an electronic device wafer, are separated as individual devices from the wafer, stacked and adhesively bonded together into a layered stack by a lamination step including the application of heat and compression to the stack, the improvement comprising:

• a. applying an adhesive material to at least one surface of said wafer to obtain a wafer having a substantially dry, solvent-free coating of adhesive material thereon;
• b. separating said wafer having said coating of adhesive material into a plurality of discrete, individual electronic devices of substantially equal size;
• c. stacking said plurality of electronic devices to form a non-integral stack of layers of electronic devices said coating of adhesive material at the interface between adjacent layers of electronic devices;
• d. applying heat and compressive loading to said non-integral stack in a progressive manner to provide viscous flow conditions of heat and pressure sufficient to soften said coatings of adhesive material and cause said coatings to undergo viscous flow sufficient to fill any non-planar irregularities at the interfaces between adjacent electronic device layers and to extrude from between said adjacent layers, thereby reducing the thicknesses of said adhesive layers and adhesive curing conditions sufficient to cure said adhesive layers into adhesive bonds between said adjacent layers;
• and
• e. cooling said stack and releasing said compressive pressure to obtain said high-density electronic package of a plurality of integral, electronic device layers.