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US 5,635,009 AGranted
Method for sticking an insulating film to a lead frame
AssigneeHitachi Cable, Ltd.
InventorsToshio Kawamura, Takashi Suzumura, Makoto Aida, Hiroshi Sugimoto, Shigeharu Takahagi, Yuju Endo, Toshi Sasaki, Hiroyuki Takasaka
Life of this patent
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Abstract
A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.
Claims2
A method for sticking an insulating film to a lead frame comprising the steps of:
- providing a punch for punching a thermally adhesive insulating film, said punch having a clearance within it for absorbing thermal expansion thereof;
- punching said thermally adhesive insulating film to provide a punched film by said punch;
- heating a lead frame placed on a heater by said heater;
- and
- pressing said punched film to said lead frame on said heater by said punch, thereby sticking said punched film to said lead frame
- wherein thermal expansion of said punch occurring as a result of carrying out the step of heating said lead frame is absorbed by said clearance of said punch.
3 more elements
Dependencies are inferred from the claim text.