US 5,635,000 AGranted

Method for screening using electrostatic adhesion

AssigneeInternational Business Machines Corporation

InventorsJon A. Casey, Cynthia J. Calli, Darren T. Cook, David B. Goland, John U. Knickerbocker, Mark J. LaPlante, David C. Long, Daniel S. Mackin, Kathleen M. McGuire, Keith C. O'Neil, Kevin M. Prettyman, Michael T. Puchalski, Joseph C. Saltarelli, Candace A. Sullivan

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Abstract

The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.

Claims7

Dependent claims

A process for screening a green sheet using an electrostatic charge, comprising the steps of:

(a) placing said green sheet with at least one hole on at least one backing sheet, such that said backing sheet entirely covers said at least one hole and forms a bi-layer,
(b) electrostatically charging said bi-layer, such that said backing sheet statically adheres to at least a portion of said green sheet,
(c) screening said bi-layer with at least one metallic paste, such that said paste fills said at least one hole in said green sheet,
(d) placing said bi-layer in an antistatic environment after said metallic paste has dried and removing said charge from said bi-layer, and
(e) removing said backing layer and thereby completing the screening of a green sheet using an electrostatic charge.

2 more elements

Dependencies are inferred from the claim text.