Ultra-low particle semiconductor method
AssigneeYieldUP International
InventorsRaj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
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AssigneeYieldUP International
InventorsRaj Mohindra, Abhay Bhushan, Rajiv Bhushan, Suraj Puri, John H. Anderson, Sr., Jeffrey Nowell
Estimating the term…
A method operates a system for wet processing of semiconductors. The system includes an inlet coupled to a fluid source, and a filter coupled to the inlet. The system also includes a sealed vessel coupled to the filter where the sealed vessel has a lower liquid portion and an upper vapor portion. The system further includes an outlet coupled to the sealed vessel. The outlet is attached to the lower liquid portion. A solvent injector coupled to the sealed vessel is also used. The solvent injector is coupled to the upper vapor portion, and supplies a gaseous mixture including a polar organic compound. The polar organic compound is a non-saturated polar organic vapor. The system also includes a gas source coupled to the sealed vessel. The gas source is coupled to the upper vapor portion, and supplies an inert gas into the upper vapor portion. A device for removing the liquid from the lower liquid portion at substantially a constant liquid level rate is also included.
A method of removing a liquid from a plurality of semiconductor wafers disposed within wafer supports in a wafer carrier, the method comprising the steps of:
A method for cleaning semiconductor wafers and removing attached particles therefrom, said method comprising steps of:
Dependencies are inferred from the claim text.