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US 5,634,370 AGranted
Composite diamond wire die
AssigneeGeneral Electric Company
InventorsThomas R. Anthony, Bradley E. Williams
Life of this patent
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Abstract
A composite diamond wire die for drawing wire has a single crystal or HTHP diamond substrate and a CVD layer or layers deposited thereon. The wire die bore extends through the diamond substrate, and the substrate is surrounded by the diamond CVD layer.
Claims25
A composite diamond wire die for drawing wire of a predetermined diameter, comprising:
- a substrate comprising a single crystal or a macle of natural or HPHT diamond and having a top surface, a bottom surface and a lateral surface connecting the top and bottom surfaces;
- a layer of CVD diamond containing intrinsic tensile stresses deposited on the lateral surface of said substrate (lateral layer);
- and
- a wire die bore comprising a wire bearing portion of substantially circular cross-section and a bore axis, said wire die bore extending from the top surface to the bottom surface through the substrate, wherein the circular cross-section of the wire bearing portion is determinative of the diameter of a wire drawn through said wire die bore.
1 more element
Dependencies are inferred from the claim text.