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US 5,634,369 AGranted
Composite diamond wire die
AssigneeGeneral Electric Company
InventorsThomas R. Anthony, Bradley E. Williams
Life of this patent
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Abstract
A composite diamond wire die for drawing wire has a single crystal or HTHP diamond substrate and a CVD layer or layers deposited thereon. The wire die bore extends through both the substrate and the CVD layers, with the wire bearing surface being located within the substrate.
Claims26
A composite diamond wire die for drawing wire of a predetermined diameter, comprising:
- a substrate comprising a single crystal or a macle of natural of HPHT diamond and having a first surface and an opposing second surface;
- a layer of CVD diamond containing intrinsic tensile stresses deposited on the first surface of said substrate (first layer);
- and
- a wire die bore comprising a wire bearing portion of substantially circular cross-section and a bore axis, said wire die bore extending through both the substrate and the CVD diamond layer and said axis intersecting said first and second surfaces, said wire bearing portion located at least partially within the substrate, whereby the circular cross-section of the wire bearing portion is determinative of the diameter of a wire drawn through said wire die bore.
1 more element
Dependencies are inferred from the claim text.