Method and apparatus for manufacturing known good semiconductor die

A method for fabricating a semiconductor die comprising:

• providing the die;
• providing a carrier for holding the die, said carrier including an external connector electrically connectable to test circuitry and a force distribution mechanism for retaining the die within the carrier;
• providing an interconnect for the carrier, said interconnect including a raised contact member for contacting a contact location on the die to establish an electrical connection therewith, said contact member in electrical communication with the external connector;
• optically aligning the contact member with the contact location;
• attaching the force distribution mechanism to the carrier to establish the electrical connection and to retain the die within the carrier in contact with the interconnect;
• testing the die using test circuitry electrically attached to the external connector on the carrier;
• and
• removing the tested die from the carrier.

A method for fabricating a known good semiconductor die comprising:

• testing a gross functionality of dice contained on a semiconductor wafer;
• sawing the wafer to separate the die;
• providing a carrier for holding the die including a connector for connection to external test circuitry and a force distribution mechanism for retaining the die within the carrier;
• providing an interconnect including a substrate having a contact member adapted to provide a temporary electrical connection to the die;
• assembling the die with the carrier by optically aligning the die and the interconnect, then placing the die and the interconnect in contact to establish an electrical connection between the contact member and a contact location on the die;
• testing the die by connecting external circuitry to the connector on the carrier;
• and
• separating the tested die from carrier.

A method for manufacturing semiconductor dice comprising:

• providing a bare die;
• providing an interconnect for making a temporary electrical connection with the die, said interconnect including a microbump contact member mounted on tape and attached to a substrate;
• aligning the contact member with a contact location on the die;
• biasing the die against the interconnect;
• testing the die by applying test signals through the contact member to the contact location;
• and
• separating the tested die from the interconnect.