Semiconductor manufacturing apparatus
AssigneeNikon Corporation
InventorKenji Nishi
Life of this patent
Estimating the term…
Abstract
An apparatus for exposing a substrate chucked on a substrate holder includes a substrate stocking device for stocking a plurality of substrates, a substrate conveying system for picking up the substrate from the substrate stocking device and conveying the substrate to the substrate, holder while chucking a portion of a rear surface of the substrate and a cleaning system for cleaning the rear surface of the substrate.
Claims17
A substrate cleaning system including a cleaning device which cleans a substrate, a substrate holding device having a first holding portion for holding said substrate and a groove portion that does not contact said substrate, and a carrying device which transfers said substrate from said cleaning device to said substrate holding device, said substrate cleaning system comprising:
- a cleaning portion provided in said cleaning device, which cleans a portion of a surface of said substrate corresponding to said first holding portion;
- a second holding portion provided in said cleaning device, which holds a portion of said surface of said substrate corresponding to said groove portion;
- and
- a third holding portion provided in said carrying device, which holds said portion of said substrate corresponding to said groove portion.
A substrate cleaning apparatus which cleans a substrate before setting said substrate on a substrate holding device having a first holding portion for holding said substrate and a groove portion that does not contact said substrate, said substrate cleaning apparatus comprising:
- a cleaning portion which cleans a portion of a surface of said substrate corresponding to said first holding portion;
- and
- a second holding portion which holds a portion of said surface of said substrate corresponding to said groove portion.
A system for handling a semiconductor substrate, comprising:
- a cleaning device to clean said substrate, including a holding portion that contacts a first portion of a surface of said substrate to hold said substrate and a cleaning portion that cleans a second portion of said substrate surface;
- a substrate holding device, which holds said substrate without contacting said first portion of said substrate surface, having a holding portion that contacts said second portion of said substrate surface;
- and
- a carrying device that transfers said substrate from said cleaning device to said substrate holding device, without contacting said second portion of said substrate surface, and having a holding portion that contacts said first portion of said substrate surface to hold said substrate.
In a system for making an integrated circuit by forming a pattern on a semiconductor substrate:
- a cleaning device to clean said substrate, including a holding portion that contacts a first portion of a surface of said substrate to hold said substrate and a cleaning portion that cleans a second portion of said substrate surface;
- a substrate holding device, which holds said substrate without contacting said first portion of said substrate surface, and having a holding portion that contacts said second portion of said substrate surface;
- and
- a carrying device that transfers said substrate from said cleaning device to said substrate holding device, without contacting said second portion of said substrate surface, and having a holding portion that contacts said first portion of said substrate surface to hold said substrate.
Dependencies are inferred from the claim text.