US 5,633,783 AGranted

Multi-chip ceramic module for mounting electric parts on both substrate and cap connected through interconnecting pins

AssigneeFujitsu Limited

InventorTakesi Yamamoto

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Abstract

Multi-layer wiring structures are respectively formed in upper and lower ceramic substrates for electric parts, and interconnecting pins held in contact with contact pads establish electrical connections between the multi-layer wiring structures so as to prevent a multi-chip module from an undesirable disconnection between the multi-layer wiring structures.

Claims7

Dependent claims

A multi-chip module comprising:

a first insulating substrate having a first surface, a second surface reverse to said first surface and an inner surface forming a hollow space open to said second surface, said hollow space having a first hollow sub-space open to said second surface and a second hollow sub-space narrower than said first hollow sub-space and contiguous to a central area of said first hollow sub-space;
a second insulating substrate having a third surface and a fourth surface reverse to said third surface, said third surface being connected to said second surface so as to close said hollow space therebetween;
a first wiring means formed at said first insulating substrate and having portions exposed to said second surface and portions exposed at said hollow space;
a second wiring means formed at said second insulating substrate and having portions exposed to said third surface and portions exposed to said fourth surface;
some of said portions of said first and second wiring means including contact pads;
at least one first electric part accommodated in said second hollow sub-space and electrically connected to said portions of said first wiring means exposed at said hollow space;
a plurality of input-and-output means provided on said fourth surface and connected to said portions of said second wiring means exposed to said fourth surface;
a plurality of conductive connecting means connected between said portions of said first wiring means exposed to said second surface and said portions of said second wiring means exposed to said third surface, said conductive connecting means including a plurality of interconnecting pins soldered to one of said first wiring means having portions exposed to said second surface and said second wiring means having portions exposed to one of said second surface and said third surface and respectively held in contact with respective contact pads of the other of said first wiring means and said second wiring means, one of said first insulating substrate and said second insulating substrate having a plurality of holes open to one of said third surface and said second surface, said respective contact pads being mounted in respective ones of said plurality of holes, said plurality of interconnecting pins being respectively inserted into said plurality of holes so as to be held in contact with said contact pads mounted in said plurality of holes, respectively;
and
at least one second electric part mounted on said third surface and connected to said portions of said second wiring means exposed to said third surface.

7 more elements

Dependencies are inferred from the claim text.

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Abstract

A multi-chip module comprising:

a first insulating substrate having a first surface, a second surface reverse to said first surface and an inner surface forming a hollow space open to said second surface, said hollow space having a first hollow sub-space open to said second surface and a second hollow sub-space narrower than said first hollow sub-space and contiguous to a central area of said first hollow sub-space;
a second insulating substrate having a third surface and a fourth surface reverse to said third surface, said third surface being connected to said second surface so as to close said hollow space therebetween;
a first wiring means formed at said first insulating substrate and having portions exposed to said second surface and portions exposed at said hollow space;
a second wiring means formed at said second insulating substrate and having portions exposed to said third surface and portions exposed to said fourth surface;
some of said portions of said first and second wiring means including contact pads;
at least one first electric part accommodated in said second hollow sub-space and electrically connected to said portions of said first wiring means exposed at said hollow space;
a plurality of input-and-output means provided on said fourth surface and connected to said portions of said second wiring means exposed to said fourth surface;
a plurality of conductive connecting means connected between said portions of said first wiring means exposed to said second surface and said portions of said second wiring means exposed to said third surface, said conductive connecting means including a plurality of interconnecting pins soldered to one of said first wiring means having portions exposed to said second surface and said second wiring means having portions exposed to one of said second surface and said third surface and respectively held in contact with respective contact pads of the other of said first wiring means and said second wiring means, one of said first insulating substrate and said second insulating substrate having a plurality of holes open to one of said third surface and said second surface, said respective contact pads being mounted in respective ones of said plurality of holes, said plurality of interconnecting pins being respectively inserted into said plurality of holes so as to be held in contact with said contact pads mounted in said plurality of holes, respectively;
and
at least one second electric part mounted on said third surface and connected to said portions of said second wiring means exposed to said third surface.

7 more elements