US 5,633,595 AGranted

IC analysis system and electron beam probe system and fault isolation method therefor

AssigneeAdvantest Corporation

InventorsKoshi Ueda, Akira Goishi, Masayuki Kuribara

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Abstract

A stop pattern setting part 203 is provided which permits setting therein a plurality of patterns for stopping the test pattern updating operation of a test pattern generator 210, and upon each generation of the test patterns set in the stop pattern setting part 203, the test pattern generator 210 is stopped from the pattern updating operation. Each time the test pattern stops, a stop signal is applied to an electron beam probe system 300, causing it to start an image data acquiring operation. Upon completion of the image data acquisition, a write completion signal generating part 308 generates a write completion signal, which is applied to the test pattern generator 210 to cause it to resume the pattern updating operation. By applying different test patterns to a device under test alternately with each other and displaying image data of the difference between resulting pieces of image data, a potential contrast image can be improved.

Claims2

Dependent claims

A method for specifying a failed portion of a device under test in a display image by an IC analysis system provided with an electron beam probe system which scans and irradiates the surface of said device under test, measures a quantity of secondary emission from each irradiated point and displays a surface potential distribution of said device under test, said method comprising the steps of:

A. turning OFF power supply to said device under test to thereby fix the logical level of a wiring conductor of said device under test to a logical low level;
B. holding OFF the power supply to said device under test and scanning and irradiating said device under test with an electron beam and acquiring first image data;
C. turning ON the power supply to said device under test;
D. holding ON the power supply to said device under test, providing a predetermined one of a series of test patterns to said device under test and, concurrently, scanning and irradiating said device under test with an electron beam and acquiring second image data;
E. creating image data of a difference between said first image data and said second image data;
and
F. displaying said difference image data.

4 more elements

Dependencies are inferred from the claim text.