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US 5,633,535 AGranted
Spacing control in electronic device assemblies
OwnerClinton C. Chao, Timothy V. Harper +2inventors
InventorsClinton C. Chao, Timothy V. Harper, John C. Wynbeek, Eric S. Schneider
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Abstract
A method of forming standoff spacer pedestals on a device above the substrate by supporting the electronic device with the standoff spacer pedestals during solder reflow and bonding. Generally, the method comprising the steps of adhering at least one layer of film solder resist on the substrate, and eliminating the undesired portions of dry film solder resist to form the pedestals.
Claims9
An apparatus comprising:
- a substrate having a plurality of conductive pads;
- an electronic device connected to the substrate;
- the electronic device having a plurality of solder humps on a surface, the electronic device being electrically and mechanically attached to the substrate such that at least one solder bump is in contact with one of the conductive pads of the substrate;
- and
- a film spacer pedestal for controlling the spacing between the substrate and the electronic device, the pedestal physically attached to the substrate, the pedestal physically separated from the solder bumps, the pedestal having a substantially flat face, the flat face being in contact with the electronic device and the spacing being defined by the height of the pedestal.
2 more elements
Dependencies are inferred from the claim text.