Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto

An electronic package comprising:

• a substantially rigid, thermally conductive support member;
• a thin, flexible circuitized substrate including a dielectric member having a first surface including at least one layer of circuitry positioned on said first surface thereof, said thin, flexible circuitized substrate including a plurality of through-holes located within said dielectric member and extending through said dielectric member to respective parts of said layer of circuitry of said thin, flexible circuitized substrate, said thin, flexible circuitized substrate being directly bonded to said support member in an electrically insulative manner, including along the portion of said dielectric member having said plurality of through-holes therein, such that said at least one layer of said circuitry faces said substantially rigid, thermally conductive support member;
• said substantially rigid, thermally conductive support member adapted for having a semiconductor device bonded to a predetermined portion of said support member in a thermally conductive manner at a location immediately adjacent said thin, flexible circuitized substrate, such that electrical contact sites of said semiconductor device can be directly electrically coupled to said thin, flexible circuitized substrate directly bonded to said support member;
• and
• first and second pluralities of solder elements each positioned on said thin, flexible circuitized substrate at respective ones of said through-holes within said dielectric member so as to be electrically coupled to said at least one layer of said circuitry, said first plurality of said solder elements being positioned nearer said predetermined portion of said substantially rigid, thermally conductive support member than said second plurality of said solder elements.