Multichip module having a multi-level configuration

Abstract

A multichip module (MCM) configuration and a method of packaging semiconductor integrated circuit chips in a multilevel arrangement are described. Essentially, a novel module template is provided for packaging multi-level semiconductor chips. The module template includes at least two chambers which communicate with each other and are arranged vertically, and a plurality of parallel pins extending outward. Each chamber contains a round-shaped stage formed on the bottom of the chamber, a plurality of leadframes formed over the stage and connected to the desired pins, and a support member formed around the upper end of the chamber. The semiconductor chips to be packaged are prepared with predetermined circuits and conductive pads. One of the semiconductor chips is first adhered to the stage of the lowest exposed chamber. The conductive pads are connected to the corresponding leadframes by metal wires. Then, a covering plate is sealed on the support member of the lowest exposed chamber. The same procedure is carried out for each chamber from the lower most to the uppermost until all of the semiconductor chips are packaged.

Dependencies are inferred from the claim text.