Resin sealing type semiconductor device and method of making the same

A method of fabricating a resin sealing type semiconductor device, comprising:

• bonding a semiconductor element to an element mounting surface of an element mounting member;
• disposing a plurality of leads on said element mounting member, said plurality of leads being insulated and separated from said semiconductor element;
• disposing a frame lead around a periphery of said semiconductor element, said frame lead being separated from said semiconductor element and said element mounting surface, said frame lead being continuous around the periphery of said semiconductor element;
• forming a plurality of wires including at least one of first wires electrically connecting a first number of said leads to a first number of electrodes of said semiconductor element, second wires electrically connecting a second number of said leads to said frame lead, and third wires electrically connecting said frame lead to a second number of said electrodes of said semiconductor element;
• and
• sealing said element mounting member, said semiconductor element, said plurality of leads and said frame lead with a resin.

A resin sealing type semiconductor device, comprising:

• an element mounting member having an element mounting surface for mounting a semiconductor element, said semiconductor element bonded to said element mounting surface of said element mounting member;
• a plurality of leads disposed on and insulated from said element mounting member, said plurality of leads being separated from said semiconductor element;
• a frame lead disposed around a periphery of said semiconductor element and separated from said semiconductor element and said element mounting surface, said frame lead being continuous around said periphery of said semiconductor element;
• at least one support lead supporting said frame lead, said plurality of leads, said frame lead and said at least one support lead being made in one body;
• a plurality of wires including at least one of first wires electrically connecting a first number of said plurality of leads to a first number of electrodes of said semiconductor element, second wires electrically connecting a second number of said plurality of leads to said frame lead, and third wires electrically connecting said frame lead to a second number of said electrodes of said semiconductor element;
• and
• a resin sealing said element mounting member, said semiconductor element, said plurality of leads, said frame lead and said at least one support lead.

A resin sealing type semiconductor device, comprising:

• an element mounting member having an element mounting surface for mounting a semiconductor element, said semiconductor element bonded to said element mounting surface of said element mounting member;
• a plurality of leads disposed on and insulated from said element mounting member, said plurality of leads being separated from said semiconductor element;
• a frame lead disposed around a periphery of said semiconductor element and separated from said semiconductor element and said element mounting surface, said frame lead being continuous around said periphery of said semiconductor element;
• a plurality of connecting means including at least one of first connecting means electrically connecting a first number of said plurality of leads to a first number of electrodes of said semiconductor element, second connecting means electrically connecting a second number of said plurality of leads to said frame lead, and third connecting means electrically connecting said frame lead to a second number of said electrodes of said semiconductor element;
• and
• a resin sealing said element mounting member, said semiconductor element, said plurality of leads and said frame lead.

A resin sealing type semiconductor device, comprising:

• an element mounting member having an element mounting surface for mounting a semiconductor element, said semiconductor element having a plurality of electrodes and said semiconductor element bonded to said element mounting surface of said element mounting member;
• a plurality of leads disposed on and insulated from said element mounting member, said plurality of leads being separated from said semiconductor element;
• at least one of a first conducting layer and a second conducting layer formed on said element mounting surface, said first conducting layer providing a ground for a number of said electrodes of said semiconductor element and said second conducting layer providing a ground for a number of said plurality of leads;
• a plurality of wires including at least one of first wires electrically connecting a first number of said plurality of leads to a first number of said electrodes of said semiconductor element, second wires electrically connecting a second number of said plurality of leads to one of said first and second conducting layers, and third wires electrically connecting one of said first and second conducting layers to a second number of said electrodes of said semiconductor element;
• and
• a resin sealing said element mounting member, said semiconductor element, and said plurality of leads.