Bonding load measuring device
AssigneeKabushiki Kaisha Shinkawa
InventorIwao Takahashi
Life of this patent
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Abstract
A device for measuring the bonding load of the bonding arm of a bonding machine including a frame body, a screw shaft rotatably installed in the frame body, a turning member for turning the screw shaft by hand, a screw assembly screw-engaged on the screw shaft so as to be movable on the screw shaft when the screw shaft is rotated, a slider connected to the screw assembly, a gauge holder provided on the slider for installing a tension gauge, a lifting member attached to the tension gauge so that the engagement part of the lifting member can engage with the bonding arm, and a mounting assembly for mounting the frame body to the wire bonding machine.
Claims1
A wire bonding load measuring device for measuring a pressing force for bonding a bonding wire to a connection means of a semiconductor device in a wire bonding machine, said device comprising:
- a frame body detachably coupled to said wire bonding machine;
- a screw shaft which rotatably is supported on said frame body so that said screw shaft is free to rotate;
- a turning member for turning said screw shaft by hand;
- a screw assembly which is screw-engaged with the screw shaft and caused to move up and down by a rotation of said screw shaft;
- a slider which moves upward and downward together with the screw assembly;
- a gauge holder fastened to said slider;
- a tension gauge detachably installed in said gauge holder in such a manner that said tension gauge can be freely installed and removed;
- a hook attached to a measuring lever of said tension gauge, said hook having an engagement part that is coupled to a bonding arm;
- and a mounting means for detachably mounting said frame body to said wire bonding machine;
- whereby said pressing force for bonding said bonding wire of a capillary mounted on said bonding arm is measured by rotating said screw shaft.
Dependencies are inferred from the claim text.