Method of making a miniaturized electronic imaging chip from a standard imaging chip

A method of forming a miniaturized electronic imaging chip from a standard imaging chip, the standard imaging chip having a substrate with a first peripheral edge defining a first area, and having stratified layers which include at least one interconnect layer, through which an image is normally projected, a pixel layer for receiving the image, a silicon layer having a second peripheral edge defining a second area which is smaller than the first area, the substrate being connected to first ends of connector pins, and having electrical leads connected between the interconnect layer and electrical contacts on the substrate to which the first ends of the connector pins are attached, the connector pins having second ends attached to circuitry which incorporates the standard imaging chip, said method comprising the steps of:

• removing the electrical leads;
• removing the at least one interconnect layer, pixel layer, and silicon layer from the substrate;
• shaving the silicon layer to a thickness which allows passage of a light image therethrough;
• bump bonding new lead to the interconnect layer within the second area of the shaved silicon layer;
• and
• reversing the chip so that a light image is projectable through the shaved silicon layer, the new leads being directly attachable to the circuitry.