Process for stripping photoresist while producing liquid crystal display device

A process for producing a liquid crystal display device which comprises the steps of:

• (A) forming gate electrodes on a substrate,
• (B) forming transparent electrodes on the substrate obtained in step (A),
• (C) forming a gate-insulating film and amorphous silicon islands on the substrate obtained in step (B),
• (D) forming source and drain electrodes on the substrate obtained in step (C), and
• (E) forming a passivation film on the substrate obtained in step (D), characterized in that the resist-peeling in at least one of steps (A) to (E) is effected by a method comprising the steps of:
• (a) changing the quality of a novolak positive resist layer on a substrate by an oxidative wet etching solution of metallic chromium, dry etching of silicon or aluminum, dry etching using oxygen plasma or ion implantation,
• (b) contacting the changed resist of step (a) with a liquid comprising 80% by weight or more of 2-amino-1-ethanol,
• (c) removing the liquid containing the thus peeled resist from the surface of the etched resist, and
• (d) regenerating a liquid containing 80% by weight or more of 2-amino-1-ethanol by distillation from the liquid used in step (c) and reusing the regenerated liquid in step (b).