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US 5,633,072 AGranted
Method of manufacturing a multilayer printed wire board
AssigneeAkzo Nobel N.V.
InventorsErik Middelman, Pieter H. Zuuring
Life of this patent
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AssigneeAkzo Nobel N.V.
InventorsErik Middelman, Pieter H. Zuuring
Estimating the term…
A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.
A multilayer printed wire board obtainable by a method comprising lamination bonding at least one hard base substrate comprising conductive traces on both sides and at least one intermediate substrate comprising a hard core layer comprising a flowable adhesive layer on at least a side thereof facing the conductive traces of the base substrate, the lamination being conducted under a pressure sufficiently high so as to bring the core layer of the intermediate substrate at least substantially into contact with the conductive traces of the base substrate with the adhesive filling the voids between the traces, and wherein the base substrate and the intermediate substrate comprising a fiber-reinforced matrix material, the reinforcement being in the form of a crosswise arrangement of layers of unidirectionally (UD) oriented fibers, and wherein the substrates are balanced and mid-plane symmetric crossply laminates exhibiting thermal coefficients of expansion in the X and Y directions about equal to those of the electrically conductive material employed.
A multilayer printed wire board obtainable by a method comprising lamination bonding at least one hard base substrate comprising conductive traces on both sides and at least one intermediate substrate comprising a hard core layer comprising a flowable adhesive layer on at least a side thereof facing the conductive traces of the base substrate, the lamination being conducted under a pressure sufficiently high so as to bring the core layer of the intermediate substrate at least substantially into contact with the conductive traces of the base substrate with the adhesive filling the voids between the traces, and wherein the base substrate and the intermediate substrate comprising a fiber-reinforced matrix material, the reinforcement being in the form of a crosswise arrangement of layers of unidirectionally (UD) oriented fibers, wherein at least one intermediate substrate comprises at least one embedded electronic component.
Dependencies are inferred from the claim text.