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US 5,633,034 AGranted
Process for forming a circuit assembly
AssigneeInternational Business Machines Corporation
InventorsKenneth R. Carter, Richard A. DiPietro, James L. Hedrick, John P. Hummel, Robert D. Miller, Martha I. Sanchez, Willi Volksen, Do Y. Yoon
Life of this patent
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Abstract
The invention relates to a process for forming a circuit assembly comprising (i) coating onto a substrate a layer of polyamic ester selected from a unique class of polyamic esters; (ii) imidizing the polyamic ester to form a layer of polyimide having an even surface and (iii) forming circuit conductors on the even surface of the polyimide.
Claims3
A process for forming a circuit assembly comprising
- (i) coating a layer of polyamic ester onto a substrate, the polyamic ester having the repeat unit:
- ##STR4## wherein Q is selected from:
- ##STR5## where X is selected from oxygen, carbonyl or C(CF.sub.3).sub.2 ;
- R" is:
- ##STR6## and R and R' are alkyl or haloalkyl;
- (ii) heating the layer to imidize the polyamic ester and form a layer of polyimide;
- and
- (iii) forming circuit lines on the surface of the layer of polyimide.
5 more elements
A process for forming a circuit assembly comprising
- (i) coating a layer of polyamic ester onto a substrate, the polyamic ester having the repeat unit:
- ##STR7## wherein Q is selected from ##STR8## R" is:
- ##STR9## and R and R' are lower alkyl or haloalkyl;
- (ii) heating the layer to imidize the polyamic ester and form a layer of polyimide;
- and
- (iii) forming circuit lines on the surface of the layer of polyimide.
3 more elements
Dependencies are inferred from the claim text.