Process for preparing a non-conductive substrate for electroplating
AssigneeMacDermid, Incorporated
InventorsDonald Ferrier, Rosa Martinez, Eric Yakobson
Life of this patent
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Abstract
The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.
Claims12
A liquid dispersion for use in enhancing the electroplating of a non-conductive surface said dispersion comprising:
- (a) carbon particles which have been surface modified by being contacted with a dye, said carbon particles having an average diameter of less than 3.0 microns in said dispersion;
- (b) a dispersant;
- and
- (c) an aqueous liquid dispersion medium;
- wherein the concentration of the carbon particles in the liquid dispersion is less than 5 percent by weight of said dispersion.
A liquid dispersion for use in enhancing the electroplating of a non-conductive surface said dispersion comprising:
- (a) carbon particles having an average diameter of less than 3.0 microns in said dispersion;
- (b) a dispersant;
- and
- (c) an aqueous liquid dispersing medium;
- wherein said carbon particles have a metal reduced or adsorbed onto the surface of said carbon particles and wherein the concentration of carbon particles in said dispersion is less than 5 percent by weight of said dispersion.
A liquid dispersion for use in enhancing the electroplating of a non-conductive surface said dispersion comprising:
- (a) carbon particles which have been surface modified by being contacted with an oxidant, said carbon particles having an average diameter of less than 3.0 microns in said dispersion;
- (b) a dispersant;
- and
- (c) an aqueous liquid dispersing medium;
- wherein the concentration of the carbon particles in the liquid dispersion is less than 5 percent by weight of said dispersion.
Dependencies are inferred from the claim text.