Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization
AssigneeInternational Business Machines Corporation
InventorsMark K. Hoffmeyer, Gregg A. Knotts, Connie J. Mathison
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Abstract
A direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization are provided. After at least one integrated circuit chip is attached to a carrier, an aqueous cleaning solution containing citric and oxalic acid based additives is applied to the carrier and attached integrated circuit chip. Then a deionized water rinse is applied to the carrier and attached integrated circuit chip, followed drying for a set time period. Next wirebonding on copper circuitization carried by the carrier is performed.
Claims15
A direct chip attachment process for aluminum wirebonding on copper circuitization comprising the steps of:
- attaching at least one integrated circuit chip to a carrier;
- applying to the carrier and attached integrated circuit chip an aqueous cleaning solution containing citric and oxalic acid based additives;
- applying to the carrier and attached integrated circuit chip a rinse;
- and
- wirebonding on copper circuitization carried by the carrier.
Apparatus for cleaning copper circuitization after one or more integrated circuit chips have been attached to a carrier supporting copper circuits comprising:
- means for applying to the carrier and attached integrated circuit chip an aqueous cleaning solution containing citric and oxalic acid based additives;
- means for applying to the carrier and attached integrated circuit chip a rinse;
- means for drying the carrier and attached integrated circuit chip for a predefined time period;
- and
- means for wirebonding on the copper circuitization carried by the carrier.
Dependencies are inferred from the claim text.