Pressure activated diaphragm bonder

A pressure activated bonder, particularly adapted to bond integrated circuit chips to a substrate, comprising:

• a first assembly,
• a second assembly,
• a diaphragm removably positioned adjacent said first and said second assemblies,
• one of said assemblies being constructed to retain therein a substrate,
• a template adapted to retain at least one chip in contact with said substrate,
• one of said assemblies being provided with means for uniformly directing gas under pressure on said diaphragm which applies uniform pressure on said at least one chip retained by said template, and
• means for heating said substrate and/or at least one chip for bonding same together.

An apparatus for bonding a plurality of chips to a substrate having bonding material on either or both of the chips and the substrate, comprising:

• a bottom block having two different area retaining sections therein,
• a smaller of said retaining sections being adapted to retain an associated substrate therein,
• a larger of said retaining sections being adapted to retain a template therein,
• said template being provided with openings of a least one size and adapted to retain therein associated chips;
• a top block having an open section therein and an opening therein in fluid communication with said open section;
• a diaphragm positioned intermediate said bottom and top blocks, and
• means for removably securing said diaphragm intermediate said bottom and top blocks.

An apparatus for bonding at least one chip to a substrate, comprising:

• a base assembly,
• an alignment plate assembly, and
• a top plate assembly,
• said base assembly being provided with means adapted for retaining an associated substrate,
• said alignment plate assembly being provided with means adapted for retaining an associated chip,
• said base assembly also being provided with means for aligning an associated chip, and
• said top plate assembly including means for applying a pressure to an associated substrate.

A pressure activated bonder, comprising:

• a first member,
• a second member,
• a diaphragm located adjacent said first and second members,
• means for supplying fluid pressure onto a surface of said diaphragm,
• means for retaining an associated first component to be bonded adjacent said diaphragm, and
• means for retaining at least another associated component to be bonded adjacent an associated first component to be bonded.