Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints
OwnerRobert Fried, Kuo J. Tseng +1inventors
InventorsRobert Fried, Kuo J. Tseng, Hsi Y. Hsiao
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Abstract
The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pockets or gaps. The result is a stronger joint and a reduction in solder overflow.
Claims18
A lead to be soldered to an electrical component in a circuit module, said lead comprising a first part adapted to extend beyond the module for external electrical connection and a second part adapted to be joined to the electrical component, said second part of said lead comprising a substantially planar interior solid portion and an edge, and a first slit in said second part extending from said interior portion towards said edge.
A circuit module comprising first and second electrical components and a lead to be soldered between said components, said lead comprising a first part adapted to extend beyond said module for external electrical connection and a second part situated between said components, said second part of said lead comprising an interior portion and an edge, and a first slit extending from said interior portion towards said edge.
Dependencies are inferred from the claim text.