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US 5,631,609 AGranted
Piezoelectric oscillator, voltage-controlled oscillator and production method thereof
AssigneeSeiko Epson Corporation
InventorsManabu Oka, Yukari Nakajima, Masayuki Kikushima, Kazuhiko Shimodaira
Life of this patent
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Abstract
The invention provides a piezoelectric oscillator including a semiconductor integrated circuit and a piezoelectric resonator or a voltage-controlled oscillator including a semiconductor integrated circuit, a piezoelectric resonator and another electronic component. The piezoelectric resonator has a cross-sectional shape of an ellipse or a track. The semiconductor integrated circuit and the electronic component are molded with a resin into a very thin unit.
Claims28
A piezoelectric oscillator comprising:
- a semiconductor integrated circuit mounted on an island of a lead frame, said semiconductor integrated circuit being electrically connected to an inner lead of said lead frame by a wire-bonded wire;
- a piezoelectric resonator having a case of a cross-sectional shape in one of an elliptic shape and a track shape, the piezoelectric resonator being disposed adjacent to said semiconductor integrated circuit;
- a lead of said piezoelectric resonator being electrically connected to said lead frame;
- a signal input lead terminal electrically connecting to said semiconductor integrated circuit, wherein an oscillation frequency is adjusted by applying a signal to the signal input lead terminal;
- and
- resin that molds said semiconductor integrated circuit, said piezoelectric resonator and said lead frame into a single unit so an outer part of said inner lead and said signal input lead terminal are exposed to an outside of the single unit.
3 more elements
A method of producing a piezoelectric oscillator comprising the steps of:
- mounting a semiconductor integrated circuit on an island of a lead frame and performing wire-bonding to electrically connect said semiconductor integrated circuit to an inner lead electrode of said lead frame;
- positioning a piezoelectric resonator on said lead frame adjacent to said semiconductor integrated circuit and then electrically connecting a lead of said piezoelectric resonator to said lead frame, said piezoelectric resonator having a case of a cross-sectional shape in one of an elliptic shape and a track shape;
- molding said semiconductor integrated circuit, said piezoelectric resonator and said lead frame with resin into a single unit while exposing an outer part of said inner lead electrode and a signal input lead terminal to an outside;
- cutting off tie-bars connecting an outer part of said inner lead electrode and said signal input lead terminal;
- applying a signal to said signal input lead terminal to adjust an oscillation frequency;
- and
- bending the outer part of said inner lead, and cutting said signal input lead terminal and a supporting lead terminal to separate said piezoelectric oscillator from said lead frame.
4 more elements
A voltage-controlled oscillator comprising:
- a semiconductor integrated circuit mounted on an island of a lead frame, said semiconductor integrated circuit being electrically connected to an inner lead of said lead frame by a wire-bonded wire;
- a piezoelectric resonator having a case in a cross-section shape of one of an elliptic shape or a track shape, the piezoelectric resonator being disposed adjacent to said semiconductor integrated circuit;
- a lead of said piezoelectric resonator being electrically connected to said lead frame;
- an electronic component mounted on a land of said lead frame;
- a signal input lead terminal electrically connected to said semiconductor integrated circuit to control data in said semiconductor integrated circuit, wherein an oscillation frequency is adjusted by applying a signal to said signal input lead terminal;
- and
- resin molding said piezoelectric resonator, said electronic component and said lead frame into a single unit, an outer part of said inner lead electrode and said signal input lead terminal being exposed to an outside.
4 more elements
A method of producing a voltage-controlled oscillator comprising the steps of:
- mounting a semiconductor integrated circuit on an island of a lead frame and performing wire-bonding to electrically connect said semiconductor integrated circuit to an inner lead electrode of said lead frame;
- positioning a piezoelectric resonator on said lead frame adjacent to said semiconductor integrated circuit and then electrically connecting a lead of said piezoelectric resonator to said lead frame, the piezoelectric resonator having a case in a cross-section shape of one of an elliptic shape or a track shape;
- mounting an electronic component on a land formed in said lead frame;
- molding said semiconductor integrated circuit, said piezoelectric resonator, said electronic component and said lead frame with a resin into a single unit while outer parts of said inner lead electrode and a signal input lead terminal are exposed to the outside;
- cutting off tie-bars connecting an outer part of said inner lead and said signal input lead terminal;
- applying a signal to said signal input lead terminal to adjust an oscillation frequency;
- and
- bending the outer part of said inner lead electrode and cutting said signal input lead terminal and a supporting lead terminal to separate said voltage-controlled oscillator from said lead frame.
5 more elements
Dependencies are inferred from the claim text.