Probe-type test handler
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTosio Ohno
Life of this patent
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Abstract
A probe-type test handler includes a measurement module for performing electrical characteristic tests on an IC, a performance board electrically connected to the measurement module in an interchangeable manner that allows the type of the performance board to be selected according to the type of the IC to be measured, a probe card having a probe needle connected to the performance board, and a pressure mechanism that allows the tip of the linear portion of the probe needle to be pressed into contact with the lead projected out of the IC package near its IC package body. A test method using the test handler is also disclosed.
Claims20
A probe-type test handler comprising:
- a measurement module accommodating an electrical circuit for the measurement of electrical characteristics of an IC;
- a performance board electrically connected to the electrical circuit in an interchangeable manner that allows the type of the performance board to be selected according to the type of the IC to be measured;
- a probe card provided with a probe needle that is formed of a linear portion, a bent portion and a beam portion that continues from the bent portion;
- and
- a pressure mechanism that allows the tip of the linear portion of the probe needle to be pressed into contact with the lead projected out of an IC package near its IC package body.
A test handler for testing an IC package comprising:
- a plurality of electrically conducting probes;
- a measurement device electrically connected to the probes for measuring an electrical characteristic of an IC package;
- a holding mechanism for holding an IC package with leads of the IC package contacting the probes;
- and
- an electrically insulating pusher opposing the probes and movable with respect to the holding mechanism to push the probes away from the holding mechanism.
A test handler for testing an IC package comprising:
- a probe card comprising a plate and a plurality of electrically conducting probes mounted on the plate, each probe having an L-shaped region having a first portion extending substantially parallel to the plate and a second portion extending away from the plate and substantially perpendicular to the first portion, the second portion having a tapered end for contacting a lead of an IC package;
- a measurement device electrically connected to the probes for measuring an electrical characteristic of an IC package;
- and
- a holding mechanism for holding an IC package with leads of the IC package contacting the probes.
Dependencies are inferred from the claim text.