Field emission micro-tip
AssigneeSamsung Display Devices Co., Ltd.
InventorJong-min Kim
Life of this patent
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Abstract
A field emission device has a rear substrate (11), a titanium or aluminum adhesive layer (12) and disposed on the substrate (11), a tungsten cathode (13) disposed on the adhesive layer (12), a micro-tip (13') protruding from the cathode (13), a titanium or aluminum mask layer (14) disposed on the cathode (13), and a metal pattern (15) formed on the mask layer (14) for supporting the cathode (13). The micro-tip (13') is formed by the simultaneous etching of the tungsten cathode (13), the adhesive layer (12), and the mask layer (14') resulting in a large internal stress in the micro-tip (13'). The residual internal stress in the micro-tip (13') results in the micro-tip (13') curving away from the substrate (11) which, consequently, facilitates electron emission.
Claims10
A field emission micro-tip, comprising:
- a substrate;
- an adhesive layer formed of a material etchable in an etching solution at a first etching rate higher than a predetermined rate, and disposed on said substrate;
- a cathode formed of a metal having an internal stress greater than a value predetermined in relation to an internal stress of said adhesive layer and having a negligible etching rate in said etching solution, and disposed on said adhesive layer;
- a micro-tip extending outwardly from said cathode and formed from a same material as said cathode;
- a mask formed of a material etchable in said etching solution at a second etching rate lower than said first etching rate, and disposed on said cathode;
- and
- a metal pattern formed on said mask for supporting said cathode.
Dependencies are inferred from the claim text.