Film carrier tape and laminated multi-chip semiconductor device incorporating the same

A multi-chip semiconductor device comprising a plurality of stacked chip semiconductor devices mounted in a multi-layer stacked configuration on a substrate, each chip semiconductor device including:

• a film carrier tape having leads;
• a semiconductor chip electrically connected to the leads of the film carrier tape;
• a heat sink mounted to a surface of the semiconductor chip;
• and
• a connector for the heat sink, the connector being electrically connected to the leads of the film carrier tape.

A laminated multi-chip semiconductor device comprising a plurality of chip semiconductor devices laminated onto a substrate, each chip semiconductor device including:

• a film carrier tape having leads;
• a semiconductor chip electrically connected to the leads of the film carrier tape;
• a heat sink mounted to a surface of the semiconductor chip;
• and
• a connector for the mounting of the heat sink, the connector being electrically connected to the leads of the film carrier tape,
• wherein the heat sink is an etched portion of the film carrier tape, the film carrier tape including a carrier member and a metallic layer superimposed thereon, the metallic layer being an etched layer forming the leads and the heat sink for the semiconductor chip.

A multi-chip semiconductor module comprising a plurality of stacked semiconductor devices, each semiconductor device including:

• a film carrier tape having leads;
• a semiconductor chip electrically connected to the leads of the film carrier;
• a heat sink mounted to a surface of the semiconductor chip;
• and
• a connector for the stacked plurality of semiconductor devices and for the heat sink, the connector being electrically connected to the leads of the film carrier tape and others of the plurality of stacked semiconductor devices.