Method for identifying molding compound using an acoustic microscope
AssigneeIntegrated Device Technology, Inc.
InventorsWilly C. Wang, Steve K. Sue
Life of this patent
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Abstract
A non-destructive method of identifying a type of molding compound in a sample using an acoustic microscope, particularly, identifying the type of molding compound used in an integrated circuit package by comparing attributes of the tested molding compound with known attributes of standard molding compounds to identify the molding compound being evaluated. The attributes that are compared include voltage, attenuation, peak frequency, average frequency, and the velocity of reflected sound.
Claims15
A method for identifying a molding compound in an integrated circuit package comprising the steps of:
- examining an integrated circuit package with an acoustic microscope;
- determining a plurality of attributes of a molding compound in said integrated circuit package with the acoustic microscope;
- and
- comparing the plurality of attributes of the molding compound in said package with attributes of known molding compounds to identify the molding compound of said package.
A method for identifying molding compound in an integrated circuit package, the method comprising the steps of:
- placing the integrated circuit package adjacent a transducer of an acoustic microscope;
- transmitting sound waves into the integrated circuit package with the transducer;
- determining a plurality of attributes of the molding compound in the integrated circuit package with the acoustic microscope;
- and
- comparing the plurality of attributes of the molding compound with attributes of known molding compounds to identify the molding compound in the integrated circuit package.
A method for identifying a molding comprising the steps of:
- examining an integrated circuit package with an acoustic microscope;
- determining a plurality of attributes of a molding compound in said integrated circuit package with the acoustic microscope;
- and
- comparing the plurality of attributes of the molding compound in said package with attributes of known molding compounds to identify the molding compound of said package;
- wherein said attributes include frequency and velocity of reflected sound.
Dependencies are inferred from the claim text.