High density lead-on-package fabrication method

Abstract

The present invention provides a method and apparatus for fabricating thermally and electrically improved electronic integrated circuits by laminating one or more lead frames to a standard integrated circuit package such as, for example, a thin small outline package (TSOP). The lead frame laminated to the package enhances thermal conduction of heat from the integrated circuit package. A heat spreader may also be utilized to improve heat transfer and can be further used as a ground plane to improve signal quality by reducing electrical circuit noise. Achieving improved thermal transfer characteristics from an integrated circuit package results in better dissipation of heat from the integrated circuit package and results in more reliable operation thereby. Using standard commercially available integrated circuit packages such as TSOP allows economical and rapid fabrication of thermally and electrically superior electronic circuits for applications that demand high reliability and performance. The method and apparatus of the present invention may be used for single integrated circuit packages or packages densely stacked into a three dimensional multi-package array.

Dependencies are inferred from the claim text.