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AssigneePoly-Flex Circuits, Inc.
InventorsDavid Durand, Chon M. Wong, Roger A. Iannetta, Jr.
Estimating the term…
A polymer lead-frame is made from a flexible substrate with flexible conductive traces. The generally square lead-frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.
A method for connecting a plurality of contact pads of a die to a respective plurality of contact points of electrically conductive traces on a flexible lead-frame, said method comprising steps of:
A method of forming a contact structure on a chip substrate, comprising steps of:
Dependencies are inferred from the claim text.