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AssigneeFujitsu Limited
InventorsKota Nishii, Kouichi Kimura, Masanobu Ishizuka, Katsura Adachi
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A polyamide resin composition including 100 parts by weight of a resin composition containing of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in% by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in the resin composition, 0.5 to 30 parts by weight of a liquid-crystalline polymer, 0.01 to 3 parts by weight of a compatibilizing agent and 2 to 40 parts by weight of an inorganic filler and optionally a rubber component. The plate thickness of the resin molded articles may be reduced to 2 mm or less, and even further to 1 mm or less without deterioration of the properties thereof.
A housing for electronic equipment, comprising a molded product of a polyamide resin composition and having an average plate thickness of 2 mm or less, the polyamide resin composition comprising 100 parts by weight of a resin composition comprised of 20 to 80% by weight of an aromatic polyamide resin and 80 to 20% by weight of a modified polyphenylene ether resin (the total amount in % by weight of the aromatic polyamide resin and the modified polyphenylene ether resin being 100% by weight) and, incorporated in said resin composition, based on 100 parts by weight of the resin composition, 0.5 to 30 parts by weight of a copolyester liquid-crystalline polymer, 0.01 to 3 parts by weight of phenylenebisoxazoline and 2 to 40 parts weight of an inorganic filler, the modified polyphenylene ether resin being produced by reacting a polyphenylene ether resin with an unsaturated aliphatic carboxylic acid or its acid anhydride.
Dependencies are inferred from the claim text.