Method of making a multichip module comprising at least one thin film probe

A process for preparing a multichip module comprising one or more thin film probes, which process comprises the steps of:

• depositing a first metal layer evenly onto a transparent or non-transparent substrate;
• masking and etching said first metal layer according to a predetermined pattern;
• depositing an intermetal dielectric layer evenly thereover;
• etching said layer according to a second predetermined pattern;
• depositing a second metal layer evenly thereover;
• etching said layer according to a third predetermined pattern;
• depositing a second intermetal dielectric layer evenly thereover;
• etching said layer such that vias are formed according to a fourth predetermined pattern;
• evenly depositing a Cr film and then a Cu film thereover;
• evenly depositing a polyimide layer thereover;
• forming one or more recesses on the module by photomasking and developing to define a position for each thin film probe;
• filling each recess with soldering material;
• heating the multichip module to about 200.degree. C. to melt the soldering material;
• mechanically polishing the multichip module to flatten the polyimide and soldering material;
• removing the polyimide;
• depositing high hardness conducting material on the soldering material in each recess;
• forming one or more tip heads by etching the high hardness material in each recess;
• and
• depositing a nitride layer on the multichip module such that only each thin film probe is exposed.