ITO sputtering target
AssigneeTosoh Corporation
InventorsToshiya Takahara, Akio Kondo
Life of this patent
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AssigneeTosoh Corporation
InventorsToshiya Takahara, Akio Kondo
Estimating the term…
An ITO sputtering target comprised of indium oxide and tin oxide and having a density of at least 6.4 g/cm.sup.3, wherein the center line average height (R.sub.a) of the surface to be sputtered is not larger than 0.8 .mu.m, and at least one property selected from the following (i), (ii) and (iii) is satisfied: (i) the maximum height (R.sub.max) is not larger than 7.0 .mu.m, (ii) the ten point average height (R.sub.z) is not larger than 6.0 .mu.m, and (iii) the maximum height (R.sub.t) of said surface as expressed by the distance between two lines which are parallel to the center line of a surface roughness curve drawn as measured at a sample length of 2.5 mm, and which sandwich said surface roughness curve, is not larger than 6.5 .mu.m. Preferably, R.sub.a and the or each property (R.sub.max, R.sub.z or R.sub.t) selected from (i), (ii) and (iii) satisfy the formula: R.sub.a .times.(R.sub.max, R.sub.z or R.sub.t).ltoreq.3.0 .mu.m.sup.2.
An ITO sputtering target comprising indium oxide and tin oxide and having a density of at least 6.4 g/cm.sup.3, wherein the center line average height (R.sub.a) of the surface to be sputtered is not larger than 0.8 .mu.m, and at least one property selected from the following surface roughness requirements (i), (ii) and (iii) is satisfied:
Dependencies are inferred from the claim text.