US 5,629,839 A · Module interconnect adapter for reduced parasitic inductance

Abstract

A mounting for a solderable component module (SCM.TM.) interconnect includes an elongated trench or blind via for receiving an edge of the module. The interconnect may be adjusted to reduce the parasitic inductance associated with the connection of the SCM interconnect and the motherboard. Preferably, the design of the finger connectors associated with the SCM interconnect or other board module can be adjusted to reduce parasitic inductance. Alternatively, the capacitance associated with the SCM interconnect or motherboard may be adjusted. The SCM interconnect preferably includes finger connectors which have a rectangular shape. The finger connectors preferably have a shape wherein the length is greater than the width and have an enhanced thickness which reduces parasitic inductance. The finger connectors are spaced close together.

Claims6

Dependent claims

A multilayer circuit board system, comprising:

a board module having finger connectors at an edge of the module;
a first circuit board layer having a mounting area for receiving the board module;
and
a second board layer having an aperture, the aperture comprising hemicylindrical contacts and configured so that the mounting area is exposed to receive the edge of the board module, Wherein the finger connectors of the module corresponds to the mounting area and wherein the finger connectors of the module are spaced 0.020 inches apart from each other to reduce parasitic inductance at the mounting area.

1 more element

Dependencies are inferred from the claim text.

Module interconnect adapter for reduced parasitic inductance

Life of this patent

Module interconnect adapter for reduced parasitic inductance

Life of this patent

Abstract

Claims6