Metal ball grid array package with improved thermal conductivity
AssigneeOlin Corporation
InventorsDeepak Mahulikar, Paul R. Hoffman, Jeffrey S. Braden
Life of this patent
Estimating the term…
Abstract
There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.
Claims13
A ball grid array electronic package having improved thermal conductivity and reduced solder member creep, comprising:
- a base selected from the group consisting of aluminum and aluminum alloys having first and second opposing sides;
- an anodization layer coating at least a portion of said base;
- a cavity formed in said first surface;
- a semiconductor device bonded to the base in said cavity;
- a metallized circuit trace directly on said anodization layer extending from said cavity to a peripheral portion of said first surface of said base, said metallized circuit trace electrically interconnected to said semiconductor device and bonded to a solder member;
- and
- a cover sealing said cavity and encapsulating said semiconductor device and an inner portion of said metallized circuit trace.
A component for a ball grid array electronic package having improved thermal conductivity and reduced solder member creep, comprising:
- a base selected from the group consisting of aluminum and aluminum alloys having first and second opposing sides;
- an anodization layer coating at least a portion of said base;
- a cavity formed in said first surface;
- and
- a metallized circuit trace directly on said anodization layer extending from said cavity to a peripheral portion of said first surface of said base, said metallized circuit trace electrically interconnected to said semiconductor device and bonded to a solder member.
Dependencies are inferred from the claim text.