Flip-chip semiconductor devices having two encapsulants
AssigneeKabushiki Kaisha Toshiba
InventorsKazuhide Doi, Masayuki Miura, Takashi Okada, Naohiko Hirano, Yoichi Hiruta
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Abstract
A semiconductor device includes a semiconductor chip which is connected to a circuit substrate via solder bumps by flip-chip connection, a first encapsulant having a large Young's modulus and filling a space between the semiconductor chip and the circuit substrate in the central portion of the semiconductor chip, and a second encapsulant having a small Young's modulus and filling a space between the semiconductor chip and the circuit substrate in the peripheral portion of the semiconductor chip. A method for manufacturing the semiconductor device includes flowing the second encapsulant into position, but not the first encapsulant.
Claims18
A semiconductor device comprising:
- at least one semiconductor chip mounted on a circuit substrate and electrically connected to a metallization layer of said circuit substrate, a row of solder bumps being between a peripheral portion of said semiconductor chip and said metallization layer of said circuit substrate;
- a first encapsulant filling a first space between said semiconductor chip and said circuit substrate in the central portion of said semiconductor chip;
- and
- a second encapsulant filling a second space, exclusive of said first space, between said semiconductor chip and said circuit substrate in the peripheral portion of said semiconductor chip, said second space including said row of solder bumps totally within it,
- wherein said first encapsulant has a larger Young's modulus than said second encapsulant.
A semiconductor device comprising:
- at least one semiconductor chip mounted on a circuit substrate by use of solder bumps and electrically connected-to a metallization layer of said circuit substrate;
- a first encapsulant filled in a space between said semiconductor chip and said circuit substrate in the central portion of said semiconductor chip;
- and
- a second encapsulant filled in a space between said semiconductor chip and said circuit substrate in the peripheral portion of said semiconductor chip;
- wherein said first encapsulant has a larger Young's modulus than said second encapsulant, and wherein the thermal expansion coefficient of said second encapsulant is substantially equal to that of said solder bumps.
Dependencies are inferred from the claim text.