Electroplated solder terminal
AssigneeInternational Business Machines Corporation
InventorsHenry A. Nye, III, Jeffrey F. Roeder, Ho-Ming Tong, Paul A. Totta
Life of this patent
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Abstract
A structure for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.
Claims21
A solder terminal on a substrate containing at least one electrically conducting member and having a plurality of electrical contact regions separated by an insulator, comprising:
- a metallic adhesion layer, etchable using a process selective to said electrically conducting member, overlying said insulator and in contact with one of said plurality of electrical contact regions;
- a CrCu alloy layer overlying and in contact with said adhesion layer;
- said process for etching the metallic adhesion layer further being selective to said CrCu adhesion layer;
- a solder bonding metallic layer overlying and in contact with said CrCu layer;
- and,
- a layer of solder overlying and in contact with said solder bonding layer.
A solder terminal on a substrate containing at least one electrically conducting member and having a plurality of electrical contact regions separated by an insulator, comprising:
- a metallic adhesion layer, selected from a group consisting essentially of TiN and TiW, overlying said insulator and in contact with one of said plurality of electrical contact regions;
- a CrCu alloy layer overlying and in contact with said adhesion layer;
- said metallic adhesion layer further being etchable selective to said CrCu layer;
- a solder bonding metallic layer overlying and in contact with said CrCu layer;
- and,
- a layer of solder overlying and in contact with said solder bonding layer.
Dependencies are inferred from the claim text.